The Mini 4-in-1 LED uses crystal LED encapsulation technology with particle sizes of 100 microns or less.
A single LED bead represents four pixels, enabling high-density packaging for ultra-small pitch LED displays.
The flip-chip process eliminates the need for bonding wires, improving optical characteristics, product reliability, and reducing failure rates.
With a high-brush drive IC, the contrast ratio reaches 5000:1, restoring true colors with vibrant and rich tones, offering high-definition clarity, while the gray level reaches 16-bit.
Modules, power supplies, system cards, and other components can be maintained from the front, eliminating the need for maintenance access channels. Only 1 second is required to remove the module, power supply, and control card, enabling quick and convenient maintenance.
The independent modular design, with single-mold production and ±0.1mm precision machining, ensures seamless and precise assembly without visible gaps.
The cabinet frame is made of die-cast aluminum alloy with precision CNC machining, ensuring high accuracy (±0.1mm) and seamless splicing.
The RGB tri-primary color imaging technology achieves broadcast-level standards. After single-point brightness and color correction, the brightness and chromaticity remain stable.
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